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 MC74VHC1G05 Single Inverter with Open Drain Output
The MC74VHC1G05 is an advanced high speed CMOS inverter with open drain output fabricated with silicon gate CMOS technology. The internal circuit is composed of three stages, including an open drain output which provides the capability to set output switching level. This allows the MC74VHC1G05 to be used to interface 5 V circuits to circuits of any voltage between VCC and 7 V using an external resistor and power supply. The MC74VHC1G05 input structure provides protection when voltages up to 7 V are applied, regardless of the supply voltage.
Features http://onsemi.com MARKING DIAGRAMS
5 VF M G G M
* * * * * *
SC-88A / SOT-353 / SC-70 DF SUFFIX CASE 419A
High Speed: tPD = 3.8 ns (Typ) at VCC = 5 V Low Internal Power Dissipation: ICC = 1 mA (Max) at TA = 25C Power Down Protection Provided on Inputs Pin and Function Compatible with Other Standard Logic Families Chip Complexity: FET = 105 Pb-Free Packages are Available
1
TSOP-5 / SOT-23 / SC-59 DT SUFFIX CASE 483
5 VF M G G 1
NC
1 OVT
5
VCC
VF = Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location.
IN A
2
PIN ASSIGNMENT
GND 3 4 OUT Y 1 2 3 NC IN A GND OUT Y VCC
Figure 1. Pinout (Top View)
4 5
FUNCTION TABLE
IN A 1 OUT Y A Input L H Y Output Z L
Figure 2. Logic Symbol
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2007
1
February, 2007 - Rev. 14
Publication Order Number: MC74VHC1G05/D
MC74VHC1G05
MAXIMUM RATINGS
Symbol VCC VIN VOUT IIK IOK IOUT ICC TSTG TL TJ qJA PD MSL FR VESD DC Supply Voltage DC Input Voltage DC Output Voltage Input Diode Current Output Diode Current DC Output Current, per Pin DC Supply Current, VCC and GND Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Thermal Resistance Power Dissipation in Still Air at 85C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 28 to 34 Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Above VCC and Below GND at 125C (Note 5) SC70-5/SC-88A/SOT-353 (Note 1) SOT23-5/TSOP-5/SC59-5 SC70-5/SC-88A/SOT-353 SOT23-5/TSOP-5/SC59-5 VOUT < GND; VOUT > VCC Characteristics Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to 7.0 -20 +20 +25 +50 *65 to )150 260 )150 350 230 150 200 Level 1 UL 94 V-0 @ 0.125 in u2000 u200 N/A $500 V Unit V V V mA mA mA mA C C C C/W mW
ILATCHUP
Latchup Performance
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN VOUT TA tr, tf DC Supply Voltage DC Input Voltage DC Output Voltage Operating Temperature Range Input Rise and Fall Time VCC = 3.3 V 0.3 V VCC = 5.0 V 0.5 V Characteristics Min 2.0 0.0 0.0 -55 0 0 Max 5.5 5.5 7.0 +125 100 20 Unit V V V C ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES
Junction Temperature C 80 90 100 110 120 130 140 NORMALIZED FAILURE RATE Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130C TJ = 120C TJ = 100C TJ = 110C TJ = 90C TJ = 80C 100 TIME, YEARS
1 1 10 1000
Figure 3. Failure Rate vs. Time Junction Temperature http://onsemi.com
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MC74VHC1G05
DC ELECTRICAL CHARACTERISTICS
VCC Symbol VIH Parameter Minimum High-Level Input Voltage Test Conditions (V) 2.0 3.0 4.5 5.5 2.0 3.0 4.5 5.5 VIN = VIH IOL = 50 mA VIN = VIH IOL = 4 mA IOL = 8 mA ILKG IIN ICC IOFF Z-State Output Leakage Current Maximum Input Leakage Current Maximum Quiescent Supply Current Power Off-Output Leakage Current VIN = VIL VOUT = VCC or GND VIN = 5.5 V or GND VIN = VCC or GND VOUT = 5.5 V VIN = 5.5 V 2.0 3.0 4.5 3.0 4.5 5.5 0 to 5.5 5.5 0 0.0 0.0 0.0 Min 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 0.1 0.1 0.1 0.36 0.36 $0.25 0.1 1.0 0.25 TA = 25C Typ Max TA 85C Min 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 0.1 0.1 0.1 0.44 0.44 $2.5 1.0 20 2.5 Max -55 TA 125C Min 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 0.1 0.1 0.1 0.52 0.52 $5.0 1.0 40 5 mA mA mA mA Max Unit V
VIL
Maximum Low-Level Input Voltage
V
VOL
Maximum Low-Level Output Voltage VIN = VIH or VIL
V
V
II I I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII II I II I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIII IIII IIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII II II II I I I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I III III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII II I II I I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIII I I IIIIIII I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIII I IIII I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I IIIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII
AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns
TA = 25C Typ 5.0 7.5 3.8 5.3 7.5 5.3 4 TA 85C -55 TA 125C Min Max Symbol tPZL Parameter Test Conditions Min Max Min Max Unit ns Maximum Output Enable Time, Input A to Y VCC = 3.3 0.3 V RL = RI = 500 W VCC = 5.0 0.5 V RL = RI = 500 W VCC = 3.3 0.3 V RL = RI = 500 W VCC = 5.0 0.5 V RL = RI = 500 W CL = 15 pF CL = 50 pF CL = 15 pF CL = 50 pF CL = 50 pF CL = 50 pF 7.1 10.6 5.5 7.5 8.5 12.0 6.5 8.5 10.0 14.5 8.0 10.0 tPLZ Maximum Output Disable Time 10.6 7.5 10 12.0 8.5 10 14.5 10.0 10 ns CIN Maximum Input Capacitance pF Typical @ 25C, VCC = 5.0 V 18 CPD Power Dissipation Capacitance (Note 6) pF 6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no-load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC.
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MC74VHC1G05
VCC OVT A VCC - 7 V A RL 50% GND tPZL Y 50% VCC tPLZ HIGH IMPEDANCE VOL +0.3 V VCC
Figure 4. Output Voltage Mismatch Application
VCC
Figure 5. Switching Waveforms
PULSE GENERATOR RT
R1 DUT CL RL
VCC x 2
CL = 50 pF equivalent (Includes jig and probe capacitance) RL = R1 = 500 W or equivalent RT = ZOUT of pulse generator (typically 50 W)
Figure 6. Test Circuit
VCC MC74VHC1G01 A B MC74VHC1G03 C D MC74VHC1G05 E F = (A * B) + (C+D) + E A 1 2 3 4 A GTL 5 RLED MC74VHC1G05 3.3 V 220 W 1.5 V 2.2 kW VCC VCC
Figure 7. Complex Boolean Functions
Figure 8. LED Driver
Figure 9. GTL Driver
ORDERING INFORMATION
Device MC74VHC1G05DFT1 MC74VHC1G05DFT1G MC74VHC1G05DFT2 MC74VHC1G05DFT2G MC74VHC1G05DTT1 MC74VHC1G05DTT1G Package SC70-5 / SC-88A / SOT-353 SC70-5 / SC-88A / SOT-353 (Pb-Free) SC70-5 / SC-88A / SOT-353 SC70-5 / SC-88A / SOT-353 (Pb-Free) SOT23-5 / TSSOP-5 / SC59-5 SOT23-5 / TSSOP-5 / SC59-5 (Pb-Free) 3000/Tape & Reel Shipping
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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4
MC74VHC1G05
PACKAGE DIMENSIONS
SC-88A, SOT-353, SC-70 CASE 419A-02 ISSUE J
A G
5
4
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
S
1 2 3
-B-
DIM A B C D G H J K N S
D 5 PL
0.2 (0.008)
M
B
M
N J C
INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087
MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20
H
K
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025 0.40 0.0157
1.9 0.0748
SCALE 20:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MC74VHC1G05
PACKAGE DIMENSIONS
TSOP-5 CASE 483-02 ISSUE F
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. 5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY. DIM A B C D G H J K L M S MILLIMETERS MIN MAX 3.00 BSC 1.50 BSC 0.90 1.10 0.25 0.50 0.95 BSC 0.01 0.10 0.10 0.26 0.20 0.60 1.25 1.55 0_ 10 _ 2.50 3.00
NOTE 5 2X
D
5X
0.10 T 0.20 T L G A
5 1 2 4 3
0.20 C A B M B S K
DETAIL Z
2X
DETAIL Z
J C 0.05 H T
SEATING PLANE
SOLDERING FOOTPRINT*
1.9 0.074
0.95 0.037
2.4 0.094 1.0 0.039 0.7 0.028
SCALE 10:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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6
MC74VHC1G05/D


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